Shuttle XPC Slim DH810S

Shuttle XPC Slim DH810S

XPC slim DH810S
Next-Gen AI Performance in an Ultra-Compact 1.35-Litre Footprint
Unleash modern desktop power without sacrificing space. The Shuttle XPC slim DH810S brings Intel’s latest Core Ultra 200 series processors ("Arrow Lake-S", LGA1851) right to the edge—complete with an integrated Neural Processing Unit (NPU) for dedicated local AI acceleration. Housed in a rugged 1.35-litre solid metal chassis, this compact powerhouse is built to thrive where standard PCs fail. Drive crisp, high-impact content across up to three independent displays with native 8K output via HDMI 2.1 and dual 4K DisplayPorts.

Engineered for 24/7 continuous operation and certified for ambient temperatures up to 50 °C, the DH810S combines advanced heatpipe cooling with industrial-grade reliability. With 8× USB ports (including 10 Gbps Type-C), Gigabit LAN, a native RS-232 COM port, and an included VESA mount, it is the ultimate engine for AI edge computing, dynamic digital signage, POS/POI systems, healthcare setups, and demanding automation environments.

Supports Intel Core Ultra 200 Series: Socket LGA1851 processors up to 65 W TDP ("Arrow Lake-S")
Up to 96 GB DDR5 Memory: 2× SO-DIMM slots (DDR5-5600, Dual Channel)
Triple Display Support: 1× HDMI 2.1 (up to 8K@60Hz) & 2× DisplayPort 1.4a (up to 4K@60Hz)
Flexible Dual Storage: 1× M.2-2280 NVMe SSD (PCIe 4.0 ×4 / SATA) + 1× 2.5" SATA drive bay
Extensive Connectivity: 8× USB ports (incl. 1× USB-C 10 Gbps & 1× USB-A 10 Gbps), 1× RS-232 COM port, Gigabit LAN
Wireless Ready: M.2-2230 slot for optional Wi-Fi/BT module & LTE kit preparation
Ultra-Compact Metal Chassis: Only 1.35 liters volume (19 × 16.5 × 4.3 cm)
Efficient Heatpipe Cooling: Dual 70 mm fans for stable long-term operation
Commercial Features: Remote power-on connector, hardware Power-on-after-power-fail, fTPM 2.0
Mounting Included: Standard VESA/wall mount kit included (75 × 75 / 100 × 100 mm)